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The MB-SC-210 is an easy-to-use spincoater for precise and uniform deposition of thin films and coatings. Its compact, vibration free and inertgas compatible design makes it a versatile and vital tool in every research facility.

The MB-SC-210 has been specifically designed for the research & development of new processes and products in the organic electronics industry with the focus on solvent based materials. The coater is built in several modules which allow configuring the overall system setup to meet the individual requirements of each application. Glovebox compatible and user friendly the individual modules provide a convenient step-to-step approach for processing metal-organic solutions under inert conditions.

A menu-driven program and a lucid set of adjustable process parameters such as process time and rotation speed provide a reliable process platform even for users who do not have in-depth experience in spin coating techniques. Several standardized and customized chucks are available to give sufficient support to the substrate even at high rotation speeds. All chucks are machined to close tolerances to assure a smooth spinning process and uniform coating. The chuck selection should be based on substrate size, weight, shape and material in order to optimize the coating process and ensure repeatable results.

In summary the MB-SC-210 with all its optional features enables quick-testing of new material formulations and optimization work of existing processes thus making it a powerful and economic tool for your research.

Please contact us if you have questions choosing the right spin coater for your specification needs.


  • Available in stand alone and/or glovebox integrated configuration
  • Wafers up to 8" or substrates up to 6"x6"
  • User friendly programming by external full color touch panel (3.5")
  • Manual and Semi-Auto layer coating
  • Standardized and customized vacuum chucks
  • Speed up to 10,000 rpm
  • Recipe programmable process parameters
  • Process bowl made of special POM resistant against most common solvents
  • Easy cleaning with exchangeable bowl protection inlets made of PE
  • Drain connection for large amount of materials
  • Substrate fixation via vacuum and safety interlock protection
  • Transparent lid (sensor controlled) w/ central dispensing hole
  • Acoustic signal when the process has finished


  • Glovebox integration
  • Semi-auto cartridge dispensing
  • Foot switch
  • Additional protection bowl
  • TRD (Increases layer uniformities)
  • Standard and customized chucks available


Please note: Specification may vary depending on system configuration.

  • Speed: 0 up to 10,000 rpm +/- 1 rpm
  • Acceleration: 0 to 10,000 rpm within 1 sec
  • Deceleration: 10,000 rpm to 0 within 2.5 sec / 8,000 rpm to 0 within 0.8 sec
  • Process time: up to max. 2376 sec
  • Dosing time: 99 seconds/segment
  • Loading/Unloading: Manual process, substrate fixation via vacuum and safety interlock protection
  • Recipes: Up to 50 programs w/ each 24 segments
  • Process parameters: Speed, acceleration, process time
  • Rotational direction: CW or CCW rotation direction can be selected
  • Vacuum chuck: Includes 2 standard chuck inlays (PAS-L) for substrates from 10x10mm (d=10mm) up to 4"x4" (d=4"/100mm);
    Additional chucks or customized chucks for optimized substrate fixation upon request.
  • Process bowl: 3 pcs. exchangeable bowl inlet provided
  • Signal: Acoustic signal when the process has finished
  • Servomotor: High-precision, highly dynamic AC servomotor

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